As I was growing up, I was becoming more and more independent in terms of opening all kinds of systems, it didn't matter to me whether it was an engine, an electrical device or something else.
When the job offer arrived, I didn't hesitate, the good atmosphere in the company as well as the job I liked, influenced me to continue working in the company.
Today I work as a digital designer, and I face quite challenging things that are current in the modern world of digitization.
We want to help students become great engineers and equip them with valuable knowledge that’s going to serve as a great base for their future development.
This constantly evolving filed of the semiconductor industry comes with a lot of challenges that can help engineers improve their skills and enlarge their knowledge.
You’ll have the opportunity to work on multiple projects that will enhance your engineering capabilities, encourage creativity and out-of-the-box thinking.
AMS is a very complex and challenging field in the world of technology and needs an advanced state-of-the-art complex solver and a powerful set of skills.
Being once in your shoes, we know how hard it can be to determine what career path is best for you and will suit your wishes and ambitions.
Our Scholarship program is the perfect opportunity to enter the semiconductor industry, learn from the best, discover your field of interest, and enjoy the financial support our company provides.

GRADUATION THESIS LIST

#TopicDomain
1Clock domain crossing – issues and how to overcome themDD
2Scheduling techniques and their implementation for queue servicingDD
3Functional safety approaches implementation  in digital designDD
4Temperature sensor IP – Analysis, modeling and verificationAMS
5Bandgap reference IP – Analysis, modeling and verificationAMS
6Voltage regulator IP – Analysis, modeling and verificationAMS
7Internal oscillator IP – Analysis, modeling and verificationAMS
8Power-on Reset IP – Analysis, modeling and verificationAMS
9IP verification – MAC merge sublayer IP – MMSL – Link Layer Discovery Protocol control – LLDPDV
10IP verification – MAC merge sublayer IP – MMSL – MAC RxDV
11IP verification – MAC merge sublayer IP – MMSL – MAC TxDV
12SoC integration – 3PIAS ProjekatDD+DV
13SoC integration – ARM – Cortex M0 platform Integration using ARM SDKDD+DV
14SoC integration – ARM – Cortex M3 platform Integration using ARM SDKDD+DV
15SoC Verification – interdisciplinary themes – SW coverage collection and analysisDV
16SoC Verification – interdisciplinary themes – CPU instructions provided by SV TB instead of reading from Memory; (SV + ARM architecture)DV
17VIP Development – PCI ExpressDV
18VIP Development – DDRDV
19VIP Development – EthernetDV
20VIP Development – USBDV
21VIP Development – CSIDV
22VIP Development – DSIDV
23VIP Development – UNIPRODV
24VIP Development – I3CDV
25VIP Development – SLIMbusDV
26VIP Development – HDMIDV
Please note, although thesis are created in collaboration with professors, you need to get final approval by your UNI professor.