You’ll have the opportunity to work on multiple projects that will enhance your engineering capabilities, encourage creativity and out-of-the-box thinking.
AMS is a very complex and challenging field in the world of technology and needs an advanced state-of-the-art complex solver and a powerful set of skills.
Being once in your shoes, we know how hard it can be to determine what career path is best for you and will suit your wishes and ambitions.
Taking a few crucial steps from the start of your internship can help you facilitate the whole onboarding process and ensure your success in this new role.
Our Scholarship program is the perfect opportunity to enter the semiconductor industry, learn from the best, discover your field of interest, and enjoy the financial support our company provides.
It is always a pleasure to host brilliant young students and showcase the challenges and beauty of hardware engineering at its finest.
We believe it’s our responsibility to support and empower the development of young minds, enabling them to study more easily and thoroughly.
We believe that by donating new equipment we allow students to work on the latest technology and gain new skills and knowledge.
The race was the perfect opportunity to show our endurance, toughness, speed, and teamwork and while doing all that, to have an amazing time with your colleagues.


1Clock domain crossing – issues and how to overcome themDD
2Scheduling techniques and their implementation for queue servicingDD
3Functional safety approaches implementation  in digital designDD
4Temperature sensor IP – Analysis, modeling and verificationAMS
5Bandgap reference IP – Analysis, modeling and verificationAMS
6Voltage regulator IP – Analysis, modeling and verificationAMS
7Internal oscillator IP – Analysis, modeling and verificationAMS
8Power-on Reset IP – Analysis, modeling and verificationAMS
9IP verification – MAC merge sublayer IP – MMSL – Link Layer Discovery Protocol control – LLDPDV
10IP verification – MAC merge sublayer IP – MMSL – MAC RxDV
11IP verification – MAC merge sublayer IP – MMSL – MAC TxDV
12SoC integration – 3PIAS ProjekatDD+DV
13SoC integration – ARM – Cortex M0 platform Integration using ARM SDKDD+DV
14SoC integration – ARM – Cortex M3 platform Integration using ARM SDKDD+DV
15SoC Verification – interdisciplinary themes – SW coverage collection and analysisDV
16SoC Verification – interdisciplinary themes – CPU instructions provided by SV TB instead of reading from Memory; (SV + ARM architecture)DV
17VIP Development – PCI ExpressDV
18VIP Development – DDRDV
19VIP Development – EthernetDV
20VIP Development – USBDV
21VIP Development – CSIDV
22VIP Development – DSIDV
23VIP Development – UNIPRODV
24VIP Development – I3CDV
25VIP Development – SLIMbusDV
26VIP Development – HDMIDV
Please note, although thesis are created in collaboration with professors, you need to get final approval by your UNI professor.